|
| |
2.54mm Wafer |
| 間距: |
PH 2.54mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.54mm Wafer |
| 塑膠 高度/寬度: |
(S Type)H=11.40mm/W=5.80mm (D,R Type)H=5.80mm/W=11.40mm |
| 觸體數量: |
02~20 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
2.50mm Wafer with Box |
| 間距: |
PH 2.50mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.50mm Wafer with Box |
| 塑膠 高度/寬度: |
H=7.00mm/W=5.70mm |
| 觸體數量: |
02~20 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
2.50mm WAFER with Box |
| 間距: |
PH 2.50mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.50mm Wafer with Box |
| 塑膠 高度/寬度: |
H=5.70mm/W=11.50mm |
| 觸體數量: |
02~20 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
PH3.96mm Wafer JST VH |
| 間距: |
PH 3.96mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
PH 3.96mm Wafer JST VH |
| 塑膠 高度/寬度: |
H=9.40mm/W=6.80mm |
| 觸體數量: |
02~16 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
3.96mm JST WAFER (VH) |
| 間距: |
PH 3.96mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
3.96mm JST Wafer (VH) |
| 塑膠 高度/寬度: |
(S Type)H=9.60mm/W=8.80mm (D Type)H=8.80mm/W=9.60mm |
| 觸體數量: |
02~14 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
2.00mm Wafer Straight Type |
| 間距: |
PH 2.00mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.00mm Wafer Straight Type |
| 塑膠 高度/寬度: |
H=6.10mm/W=4.70mm |
| 觸體數量: |
02~16 |
| 接觸電鍍: |
Tin Plated/Gold Filled |
|
|
|
|
| |
2.00mm Wafer Right Angel Type |
| 間距: |
PH 2.00mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.00mm Wafer Right Angle Type |
| 塑膠 高度/寬度: |
H=5.00mm/W=7.60mm |
| 觸體數量: |
02~16 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
2.00mm Wafer Dual Row Type |
| 間距: |
PH 2.00mm |
| 塑膠的排數: |
雙排 |
| 產品敘述: |
2.00mm Wafer Dual Row Type |
| 塑膠 高度/寬度: |
H=6.50mm/W=5.00mm |
| 觸體數量: |
06~40 |
| 接觸電鍍: |
Tin Plated/Gold Plated |
|
|
|
|
| |
2.54mm Wafer Straight Typ |
| 間距: |
PH 2.54mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.54mm Wafer Straight Type |
| 塑膠 高度/寬度: |
H=8.40mm/W=6.40mm |
| 觸體數量: |
02~20 |
| 接觸電鍍: |
Tin Plated |
|
|
|
|
| |
2.54mm Wafer SMD Type |
| 間距: |
PH 2.54mm |
| 塑膠的排數: |
單排 |
| 產品敘述: |
2.54mm Wafer SMD Type |
| 塑膠 高度/寬度: |
H=8.20mm/W=6.40mm |
| 觸體數量: |
02~15 |
| 接觸電鍍: |
Tin Plated |
|
|
|
